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Λεπτομέρειες:
Πληρωμής & Αποστολής Όροι:
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Λειτουργία: | Αύξηση, Μείωση | Διάταξη Εξόδου: | Θετικό ή Αρνητικό |
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Τοπολογία: | Μπακ, Βάουστ. | Τύπος εξόδου: | Ρυθμιζόμενο |
Αριθμός Εξόδων: | 1 | ||
Επισημαίνω: | 528MHz ARM Cortex-A7 MPU,MCIMX6U5EVM10AC,MCIMX6U5EVM10AC ARM Cortex-A7 MPU |
MCIMX6U5EVM10AC i.MX 6UltraLite ARM Cortex-A7 MPU @ 528MHz 128KB L2 Cache 10/100 Ethernet 2x USB 2.0 8x UART Secure Boot Industrial Temp (-40°C to +105°C) Low Power Design
Features
The i.MX 6Solo/6DualLite processors are based on Arm Cortex-A9 MPCore Platform, which has the following features:
• The i.MX 6Solo supports single Arm Cortex-A9 MPCore (with TrustZone)
• The i.MX 6DualLite supports dual Arm Cortex-A9 MPCore (with TrustZone)
• The core configuration is symmetric, where each core includes:
— 32 KByte L1 Instruction Cache
— 32 KByte L1 Data Cache
— Private Timer and Watchdog
— Cortex-A9 NEON MPE (Media Processing Engine) Co-processor
The Arm Cortex-A9 MPCore complex includes:
• General Interrupt Controller (GIC) with 128 interrupt support
• Global Timer
• Snoop Control Unit (SCU)
• 512 KB unified I/D L2 cache:
— Used by one core in i.MX 6Solo
— Shared by two cores in i.MX 6DualLite
• Two Master AXI bus interfaces output of L2 cache
• Frequency of the core (including NEON and L1 cache), as per Table 8.
• NEON MPE coprocessor
— SIMD Media Processing Architecture
— NEON register file with 32x64-bit general-purpose registers
— NEON Integer execute pipeline (ALU, Shift, MAC)
— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)
— NEON load/store and permute pipeline
The SoC-level memory system consists of the following additional components:
— Boot ROM, including HAB (96 KB)
— Internal multimedia / shared, fast access RAM (OCRAM, 128 KB)
— Secure/non-secure RAM (16 KB)
• External memory interfaces: The i.MX 6Solo/6DualLite processors support latest, high volume, cost effective handheld DRAM, NOR, and NAND Flash memory standards.
— 16/32-bit LP-DDR2-800, 16/32-bit DDR3-800 and DDR3L-800 in i.MX 6Solo; 16/32/64-bit LP-DDR2-800, 16/32/64-bit DDR3-800 and DDR3L-800, supporting DDR interleaving mode for 2x32 LPDDR2-800 in i.MX 6DualLite
— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size, BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 40 bit.
— 16/32-bit NOR Flash. All WEIMv2 pins are muxed on other interfaces.
— 16/32-bit PSRAM, Cellular RAM
Introduction
The i.MX 6Solo/6DualLite automotive and infotainment processors represent the latest achievement in integrated multimedia-focused products offering high-performance processing with a high degree of functional integration. These processors are designed considering the needs of the growing automotive infotainment, telematics, HMI, and display-based cluster markets.
The processors feature advanced implementation of single/dual Arm®Cortex®-A9 core, which operates at speeds of up to 1GHz. They include 2D and 3D graphics processors, 1080p video processing, and integrated power management. Each processor provides a 32/64-bit DDR3/DDR3L/LPDDR2-800 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth®, GPS, hard drive, displays, and camera sensors.
INFORMATION
Category
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Manufacturer
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NXP USA Inc.
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Series
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Packaging
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Tray
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Part Status
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Active
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Core Processor
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ARM® Cortex®-A9
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Number of Cores/Bus Width
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2 Core, 32-Bit
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Speed
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1.0GHz
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Co-Processors/DSP
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Multimedia; NEON™ SIMD
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RAM Controllers
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LPDDR2, LVDDR3, DDR3
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Graphics Acceleration
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Yes
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Display & Interface Controllers
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Keypad, LCD
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Ethernet
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10/100/1000Mbps (1)
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SATA
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-
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USB
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USB 2.0 + PHY (4)
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Voltage - I/O
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1.8V, 2.5V, 2.8V, 3.3V
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Operating Temperature
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-20°C ~ 105°C (TJ)
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Security Features
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ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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Mounting Type
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Surface Mount
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Package / Case
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624-LFBGA
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Supplier Device Package
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624-MAPBGA (21x21)
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Additional Interfaces
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CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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Base Product Number
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Drawing
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Product List
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